MediaTek Dimensity 8100 and Dimensity 8000 chipsets have been declared by the firm on Tuesday. The firm’s new chipsets are aimed at the flagship segment and will go head-to-head with rival Qualcomm’s Snapdragon 888 SoC. The start of the new chips arrives four months right after the debut of the 4nm MediaTek Dimensity 9000 SoC, and smartphones with this chipset are envisioned in the coming months. Meanwhile, the chip company also declared the launch of the MediaTek Dimensity 1300 SoC, which is an upgraded variation of the firm’s Dimensity 1200 chipset introduced previous yr.
The organization unveiled on Tuesday that the MediaTek Dimensity 8100 and Dimensity 8000 chipsets will aspect 4 Cortex-A78 performance cores and 4 Cortex-A55 performance cores, alongside with a Mali G610 MC6 GPU. The efficiency cores on the Dimensity 8100 offer 2.85GHz speeds, although the Dimensity 8100 gives up to 2.75GHz. The Dimensity 8100 and Dimensity 8000 are designed on TSMC’s 5nm procedure.
Equally chipsets aspect MediaTek’s HyperEngine 5. know-how for efficiency and enhanced body rates — a most of 120fps for MediaTek Dimensity 8100 and 140fps for the Dimensity 8000 SoC. In the meantime, the chipsets also help LPDDR5 RAM and UFS 3.1 storage, according to the company.
The chipsets feature the MiraVision 780 exhibit motor and smartphones run by these chipsets can support up to 168Hz refresh charge at whole-Hd+ (1,080×1,920 pixels) resolution, when the MediaTek Dimensity 8100 SoC will also support 120Hz refresh fee at WQHD+ (1,440×2,560 pixels) resolution. The Dimensity 8000 chipsets are powered by a 5 gigapixel-for every-2nd ISP for quickly HDR picture and video capturing, according to MediaTek.
Both of those the MediaTek Dimensity 8100 and Dimensity 8000 chipsets will characteristic Imagiq 780 ISP with assistance for 200-megapixel cameras and HDR10+ movie recording assist at 4K resolution at 60fps. They will offer you twin digicam HDR video clip recording at the same time on the entrance and rear digicam, or two rear digicam lenses.
In the same way, each chipsets will offer 5G connectivity with an R16-completely ready 5G modem that provides 2CC carrier aggregation, and the company’s UltraSave 2. ability preserving attribute. Having said that, like the MediaTek Dimensity 9000 SoC, these chipsets do not guidance mmWave 5G connectivity. Equally MediaTek Dimensity 8100 and Dimensity 8000 chipsets assist Wi-Fi 6E and Bluetooth 5.3 connectivity, according to the organization.
MediaTek also declared the debut of the Dimensity 1200 SoC as a successor to the 6nm Dimensity 1200 chipset introduced previous year. The chipset options a superior-overall performance ARM Cortex-A78 core clocked at 3GHz, three effectiveness Cortex-A78 cores, and 4 Cortex-A55 effectiveness cores.
Smartphone enthusiasts will not have to wait around for long as the MediaTek Dimensity 8100, Dimensity 8000, and Dimensity 1300 chipsets are set to debut on smartphones in “the very first quarter of 2022” from some of the “world’s most important smartphone manufacturers,” according to the firm.
For particulars of the most up-to-date Nokia, Samsung, Lenovo, and other merchandise launches from the Cellular Earth Congress in Barcelona, go to our MWC 2022 hub.